Semiconductor EMC plastic packaging, mold cleaning adhesive, mold carbon deposition, flying edge residue cleaning consumables

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Semiconductor EMC plastic packaging, mold cleaning adhesive, mold carbon deposition, flying edge residue cleaning consumables

$11.43 / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Tianjin

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Price Disclaimer

Product Name

Semiconductor mold cleaning adhesive

Material

Rubber based composite materials

Functional purpose

Remove mold surface carbon, resin residue, and flying edge impurities

Product Features

Mold cleaning without disassembly, does not damage the coating of the mold

product form

Available in strip and block shapes

Process advantage

Shorten downtime and increase machine utilization rate

Usage effect

Reduce adhesive bubbles and improve packaging yield

supporting services

Free samples are available and foreign object analysis is provided

customized service

Support customized specifications as needed

Supply type

In stock

Adaptation scenario

Semiconductor chip packaging production line

core function

Control packaging production costs

product category

Semiconductor plastic packaging supporting materials

Product Series

Integrated rubber material with clear and smooth mold

Applicable Industries

Semiconductor packaging manufacturing

Details

Price Disclaimer

Price:The price shown on Aicaigou (foreign currency prices use an estimated exchange rate) is a reference. The final price may change due to promotions, quantity, or specs. For offline transactions, the mutually agreed price prevails; for online orders, the price is as shown at checkout.
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