Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation on the surface area of plastic sealing molds

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Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation on the surface area of plastic sealing molds

$13.57 / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Tianjin

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation in plastic sealing mold area

Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation in plastic sealing mold area

Price Disclaimer

Product Name

Semiconductor mold cleaning adhesive

Sulfurization temperature

175℃

vulcanization time

300 seconds to 350 seconds

work pressure

80kg~100kg

Scope of application

Axial packaging 1A-6A, SOP, DIP

Applicable subjects

IC、MCU、 Power devices, storage chips, discrete devices

Functional purpose

Remove mold surface carbon, resin residue, and flying edge impurities

Product Features

Mold cleaning without disassembly, does not damage the coating of the mold

Process advantage

Shorten downtime and increase machine utilization rate

Usage effect

Reduce adhesive bubbles and improve packaging yield

supporting services

Free samples are available and foreign object analysis is provided

Protective function

Reduce mold loss and minimize the frequency of mold repairs

Product Type

Mold cleaning and maintenance consumables

Adaptation scenario

Semiconductor chip packaging production line

Applicable Industries

Semiconductor packaging manufacturing

Details

Price Disclaimer

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