Semiconductor specific lubricant, multi category chip packaging mold surface lubricant and protective adhesive

Semiconductor multi category lubricant suitable for various chip packaging mold surface lubrication and protection operations

Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation on the surface area of plastic sealing molds

Chip mass production, mold cleaning adhesive adaptation, assembly line operation to improve production efficiency

Semiconductor specific release adhesive for efficient demolding and adaptation to various semiconductor devices

Chip packaging rubber with temperature and pressure resistance characteristics suitable for various plastic packaging molding processes

Special auxiliary material for lubrication, isolation and protection of semiconductor mold surface with white lubricant adhesive

Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation in plastic sealing mold area