Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation in plastic sealing mold area

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Semi conductive volume carbon cleaning adhesive improves the problem of poor carbon accumulation in plastic sealing mold area

$11.43 / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Tianjin

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Price Disclaimer

product name

Cleaning adhesive, base adhesive, moisturizing adhesive, release adhesive, lubricating adhesive

vulcanization time

300 seconds to 350 seconds

Functional purpose

Remove mold surface carbon, resin residue, and flying edge impurities

Product Features

Mold cleaning without disassembly, does not damage the coating of the mold

Process advantage

Shorten downtime and increase machine utilization rate

customized service

Support customized specifications as needed

Supply type

In stock

Applicable process

Epoxy EMC plastic sealing process

Product Type

Mold cleaning and maintenance consumables

core function

Control packaging production costs

product category

Semiconductor plastic packaging supporting materials

Performance characteristics

Temperature and pressure resistance, suitable for plastic sealing conditions

Product Series

Integrated rubber material with clear and smooth mold

Applicable Industries

Semiconductor packaging manufacturing

Packaging specification

Conventional packaging can be adjusted through negotiation

Details

Price Disclaimer

Price:The price shown on Aicaigou (foreign currency prices use an estimated exchange rate) is a reference. The final price may change due to promotions, quantity, or specs. For offline transactions, the mutually agreed price prevails; for online orders, the price is as shown at checkout.
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