Special auxiliary material for lubrication, isolation and protection of semiconductor mold surface with white lubricant adhesive

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Special auxiliary material for lubrication, isolation and protection of semiconductor mold surface with white lubricant adhesive

$11.43 / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Tianjin

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Price Disclaimer

Material

Rubber based composite materials

Sulfurization temperature

175℃

work pressure

80kg~100kg

Scope of application

Axial packaging 1A-6A, SOP, DIP

Applicable subjects

IC、MCU、 Power devices, storage chips, discrete devices

Functional purpose

Remove mold surface carbon, resin residue, and flying edge impurities

Product color

Available in gray and white

Process advantage

Shorten downtime and increase machine utilization rate

Usage effect

Reduce adhesive bubbles and improve packaging yield

Supply type

In stock

Product Type

Mold cleaning and maintenance consumables

Adaptation scenario

Semiconductor chip packaging production line

core function

Control packaging production costs

product category

Semiconductor plastic packaging supporting materials

Packaging specification

Conventional packaging can be adjusted through negotiation

Details

Price Disclaimer

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