Molybdenum copper alloy Mo Cu high thermal conductivity and low thermal expansion coefficient microelectronic packaging material

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Molybdenum copper alloy Mo Cu high thermal conductivity and low thermal expansion coefficient microelectronic packaging material

$negotiable / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Beijing, Beijing

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

brand name

Suitable application scenarios

Microelectronics packaging materials, high-power device materials

Stampable

Yes

Leak detection performance of helium mass spectrometer

Leakage material airtightness<

Aluminum content

Adjust according to the specific formula to comply with MoxCuy, x+y=100

Rollability

better

Product Name

Molybdenum copper alloy

ductility

Good

Main metal content

molybdenum

density

low

Material characteristics

Almost completely dense, defect free, and fine-grained structure

Conductivity

Good

Arc breaking performance

Good

Welding compatibility

Matching with chips, ceramics, and Kovar

copper content

tall

Nickel content

Adjust according to the specific formula to comply with MoxCuy, x+y=100

Usage Features

Can be used in ceramic packaging for alumina

Production suitability

Can be rolled and stamped, suitable for large-scale production

Titanium content

Can be adjusted according to specific formulas

kind

Copper alloy

grade

Molybdenum copper alloy

coefficient of thermal expansion

Between copper or aluminum

Details

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