High purity molybdenum wafer semiconductor packaging material, high-temperature electronic component support structure

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Attributes

High purity molybdenum wafer semiconductor packaging material, high-temperature electronic component support structure

$negotiable / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Beijing, Beijing

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

Custom brand

Applicable production processes

Precision machining and electroplating

Historical supporting situation

Multiple high-performance semiconductor electronic packaging heat sink products

Processing degree

High purity and precision

type

wafer

Specification

Multiple specifications to choose from

kind

Molybdenum wafer

auxiliary equipment

Suitable for high-end manufacturing equipment in semiconductors, electronics, and optics

Operating temperature

high temperature

Historical supporting facilities

Widely used in the semiconductor industry

Scope of application

Electrode materials for semiconductor devices

material

molybdenum

Packaging specification

standard packaging

Application Fields

Semiconductors, electronics, optics, aerospace

Material characteristics

High melting point, high hardness, excellent thermal and electrical conductivity

Is it imported

Applicable Industries

Semiconductors, electronics, optics, aerospace, etc

Scope of application

Supporting structures for high-temperature electronic components, optical coating substrates, etc

production capacity

Capable of producing the entire industry chain

Does it support customized processing

Yes

Level

high purity

Monthly production

Production based on order quantity

Category

Mechanical equipment accessories

manufacturer

High tech enterprises

Details

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