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Attributes
Copper alloy CPC heat dissipation plate, high thermal conductivity, low expansion microelectronic package chip heat dissipation carrier
$negotiable / kilogram
Reference Price1kilogram (Min. Order)
Ship From
Beijing, Beijing
Shipping
To be negotiated with the supplier
Customization
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Key Attributes
Details
Price Disclaimer
Brand
Custom brand
Applicable accessory types
Microelectronics packaging, RF devices, optical communication chips, etc
Corrosion resistance
strong
solderability
Yes
electric current
Depending on specific power and heat dissipation requirements
Core material ratio
Mo70Cu30
Material characteristics
High thermal conductivity, low coefficient of expansion, bondable, weldable, corrosion-resistant
coefficient of linear expansion
low
cooling method
heat conduction
Specifications and Dimensions
Multiple specifications to choose from
Application scenarios
Wireless communication, mobile base stations, aircraft, radar, ships, artificial satellites, etc
heat dissipation effect
excellent
Thermal conductivity change mode
By combining the composition and stacking ratio of Cu Mo core material
laminated structure
sandwich structure
Time of invention
In the 1990s
Installation type
Depending on specific application scenarios
Product weight
Depending on specific specifications
Application field
Electronic packaging, RF devices, optical communication and other fields
Type of radiator
Copper alloy composite material heat dissipation plate
Material Composition
Cu Mo composite material
Surface Treatment
Anti corrosion treatment
color
Copper color
Air volume
Not applicable (this product is a heat sink, not an air-cooled device)
Details
Price Disclaimer
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