Tungsten copper alloy W-Cu high thermal conductivity, high temperature resistance, and high-power device base material

Photos

Attributes

Tungsten copper alloy W-Cu high thermal conductivity, high temperature resistance, and high-power device base material

$negotiable / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Beijing, Beijing

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

Product Recommendations

View Details

High purity molybdenum wafer semiconductor packaging material, high-temperature electronic component support structure

$negotiable

View Details

Copper alloy CPC heat dissipation plate, high thermal conductivity, low expansion microelectronic package chip heat dissipation carrier

$negotiable

View Details

High precision light reflection mirror laboratory specific optical instruments and scientific research equipment are essential

$negotiable

View Details

High thermal conductivity crystal heat sink semiconductor optoelectronic device heat dissipation copper tungsten alloy high temperature resistance

$negotiable

View Details

Molybdenum copper alloy Mo Cu high thermal conductivity and low thermal expansion coefficient microelectronic packaging material

$negotiable

View Details

Kovar copper lead 4J50 material for vacuum device sealing material for semiconductor packaging lead

$negotiable

View Details

Pre gold-plated tin solder tungsten copper heat sink electrode laser bar RF microwave special

Brand

Custom brand

Fine-grained structure

Can achieve almost complete density and no defects

softening temperature

Adjustable according to the ratio of tungsten to copper

Product Name

Tungsten copper alloy

hardness

high-intensity

coefficient of thermal expansion

low

grade

WxCuy

Main metal content

Tungsten and Copper

impurity content

low

Application Fields

Aerospace, laser, optical communication, radar aircraft, power electronics, etc

Application Type

High power device base, optical communication tube shell, laser heat sink, etc

copper content

high content

thermal expansion

small

Material characteristics

High temperature resistance, arc welding resistance, good strength, high specific gravity

Welding compatibility

Match and solder with various chips, ceramics, and Kovar

granularity

Adjustable as needed

Material

tungsten copper

Specific gravity

tall

Cutting ability

Easy to cut

Conductivity and thermal conductivity

Good

kind

Copper alloy

Details

Price Disclaimer

Price:The price shown on Aicaigou (foreign currency prices use an estimated exchange rate) is a reference. The final price may change due to promotions, quantity, or specs. For offline transactions, the mutually agreed price prevails; for online orders, the price is as shown at checkout.
Note:Promotional prices shown on the product page are for specific periods only.The final price is either the checkout total or what you agree with the merchant.If you see an issue with a price or deal, contact the merchant before buying.

Important Notice

The above product information is provided by BAIDUAICAIGOU, who are responsible for its authenticity, accuracy, and legality.
Should any issues arise regarding a product, please contact the third-party for its removal. Aicaigou will actively assist and cooperate in this process.
During trade, please diligently verify all credentials of your business partners to prevent fraud.