DIP packaging lubricant for direct insertion of semiconductor device molds, lubrication isolation and anti adhesive material

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DIP packaging lubricant for direct insertion of semiconductor device molds, lubrication isolation and anti adhesive material

$13.57 / kilogram

Reference Price

1kilogram (Min. Order)

Ship From

Tianjin

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Price Disclaimer

Product Name

Semiconductor mold cleaning adhesive

Sulfurization temperature

175℃

vulcanization time

300 seconds to 350 seconds

work pressure

80kg~100kg

Applicable subjects

IC、MCU、 Power devices, storage chips, discrete devices

Functional purpose

Remove mold surface carbon, resin residue, and flying edge impurities

product form

Available in strip and block shapes

Product color

Available in gray and white

supporting services

Free samples are available and foreign object analysis is provided

customized service

Support customized specifications as needed

Supply type

In stock

Protective function

Reduce mold loss and minimize the frequency of mold repairs

Product Type

Mold cleaning and maintenance consumables

Adaptation scenario

Semiconductor chip packaging production line

product category

Semiconductor plastic packaging supporting materials

Details

Price Disclaimer

Price:The price shown on Aicaigou (foreign currency prices use an estimated exchange rate) is a reference. The final price may change due to promotions, quantity, or specs. For offline transactions, the mutually agreed price prevails; for online orders, the price is as shown at checkout.
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