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Attributes
Cleaning and lubrication dual-use adhesive material for integrated rubber chip plastic sealing mold
$11.43 / kilogram
Reference Price1kilogram (Min. Order)
Ship From
Tianjin
Shipping
To be negotiated with the supplier
Customization
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Key Attributes
Details
Price Disclaimer
Product Name
Semiconductor mold cleaning adhesive
Material
Rubber based composite materials
Sulfurization temperature
175℃
vulcanization time
300 seconds to 350 seconds
Scope of application
Axial packaging 1A-6A, SOP, DIP
Applicable subjects
IC、MCU、 Power devices, storage chips, discrete devices
Product color
Available in gray and white
Process advantage
Shorten downtime and increase machine utilization rate
customized service
Support customized specifications as needed
Supply type
In stock
Protective function
Reduce mold loss and minimize the frequency of mold repairs
Product Type
Mold cleaning and maintenance consumables
core function
Control packaging production costs
Performance characteristics
Temperature and pressure resistance, suitable for plastic sealing conditions
Product Series
Integrated rubber material with clear and smooth mold
Details
Price Disclaimer
- Price:The price shown on Aicaigou (foreign currency prices use an estimated exchange rate) is a reference. The final price may change due to promotions, quantity, or specs. For offline transactions, the mutually agreed price prevails; for online orders, the price is as shown at checkout.
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