Fangda wafer grinding machine, semiconductor material and device thinning grinding and polishing machine, free samples available

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Fangda wafer grinding machine, semiconductor material and device thinning grinding and polishing machine, free samples available

$1142.86

Reference Price

1platform (Min. Order)

Brand

Fangda

Negotiable

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

Fangda

Does it support customized processing

Yes

Model number

FD300QA

Vacuum suction cup size

300mm

Maximum processing size

300mm

Workpiece carrier speed (continuously adjustable)

0-300rpm/min

Grinding wheel size

300mm (12 inches)

Wheel speed (adjustable)

100-3000rpm/min

Grinding wheel spindle power

7.5kW

Product processing thickness error

≤±0.001mm(Φ100mm)

Product processing flatness

≤0.001mm(Φ100mm)

Minimum thinning thickness of the product

≥0.07mm(Φ100mm)

roughness

Ra≤0.2

Feed repetition positioning accuracy

0.001mm

Minimum set step distance for feed

0.001mm/s

vacuum negative pressure

20-90Kpa

Resolution of grating control system

0.0001mm

rubbing way

Wafer rotation, axial cut in feed grinding (in Feed)

Thinning form

Single axis single station rotating worktable

Operation method

Semi automatic grinding method (manual loading and unloading)

Equipment external dimensions

1200*1250*2100mm

weight

2350kg

Details

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