Shenzhen Fangda Grinding Technology Co., Ltd
Powerful Factory5yearsOS 5

Fangda high-precision equipment wafer grinding machine Taiko process grinding equipment thinning machine manufacturer worry free after-sales service

$371.43
Reference Price
1platform (Min. Order)
Brand
Fangda
Negotiable
Ship From
Shenzhen, Guangdong
Shipping
To be negotiated with the supplier
Customization
For customization requests, please
Brand
Fangda
Does it support customized processing
Yes
Model number
FD2002A
Vacuum suction cup size
150mm
Number of vacuum suction cups
1 piece
Suction cup speed
0-300rpm/min
Suction cup motor power
2kW
Grinding wheel motor power
5.5kW
Grinding wheel size
72mm
grinding method
Rough grinding+fine grinding
Grinding wheel speed
0-3000rpm/min
Thickness control accuracy
3μm
Thickness control range
50μm~100μm
power supply voltage
3-phase 380V
Device dimensions
1700*1300*2170
Equipment weight
1800kg
Details









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