Shenzhen Fangda Grinding Technology Co., Ltd
Powerful Factory5yearsOS 5

Fangda wafer thinning machine fully automatic thinning equipment supports customized free samples

$714.29
Reference Price
1platform (Min. Order)
Brand
Fangda
Negotiable
Ship From
Shenzhen, Guangdong
Shipping
To be negotiated with the supplier
Customization
For customization requests, please
Brand
Fangda
Does it support customized processing
Yes
Model number
FDG2003A
Applicable wafer size
4、5、6、8inch
grinding method
Wafer rotary feed grinding
Grinding wheel
200mm diamond grinding wheel
Rated output power
5.5kW
speed range
1000-3500rpm
Equipment appearance dimensions (W × D × H)
800×2450×1800mm
Equipment weight
≈2500kg
Place of Origin
Shenzhen
Is it imported
No
Scope of application
Silicon wafers, SiC, Sapphire, ceramics and other materials
Sellable land
nationwide
quality
Brand new
Details











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