Customized BGA621-0.8 alloy knob flip test fixture BGA packaging chip fixture socket

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Attributes

Customized BGA621-0.8 alloy knob flip test fixture BGA packaging chip fixture socket

$1142.86

Reference Price

1sleeve (Min. Order)

Customized

Knob flip cover with heat dissipation structure

$1142.86

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Customized BGA144-1.27mm power chip test stand/aging stand/test fixture/socket

Brand

HMILU

Model number

BGA621-0.8

Device Type

Adapter

type

Alloy knob flip test fixture

color

black

Rated current value

Contact electroplating

Gold

series

BGA

Contact material

BerylliumCopper

Location/socket

621

Function

BGA packaging chip function testing and aging testing socket

insulating material

PEEK

Maximum operating temperature

125

Minimum operating temperature

-25

unit weight

Length

packaging

boxed

Minimum packaging quantity

Details

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