SOT363-6L flip aging seat MMIC amplifier chip testing TSSOP6 package aging acceleration test

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Attributes

SOT363-6L flip aging seat MMIC amplifier chip testing TSSOP6 package aging acceleration test

$5.43

Reference Price

1individual (Min. Order)

online trading

SOT363-6L flip aging seat

Negotiable

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

HMILU

Model number

SOT363-6L flip aging seat

Device Type

Adapter

type

SOT363/353/323/SC70

Contact electroplating

Gold

Contact material

BerylliumCopper

Location/socket

6Pad

Function

aging test

Maximum operating temperature

155℃

Minimum operating temperature

-55℃

packaging

boxed

Minimum packaging quantity

Packaging/Specifications

SMD

spacing

0.65

Total number of pins

certification body

encapsulation

SOT363/353/323/SC70

quantity

1pcs

Batch number

Subject to shipment

Can the current be too high

Paid upgrade

Contact method

surface mount

Contact medium

probe

Body length

1.5

Pin length

2.1

Details

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