CQFP100-0.5 Ceramic Assembly Ceramic Packaging DC/AC Chip Test Stand Burning Stand Test Fixture

Photos

Attributes

CQFP100-0.5 Ceramic Assembly Ceramic Packaging DC/AC Chip Test Stand Burning Stand Test Fixture

$214.29

Reference Price

1individual (Min. Order)

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

HMILU

Model number

CQFP100 Ceramic Seal Aging Seat

packaging

boxed

Part status

on sale

Installation Type

Snap in type

Characteristics

CQFP100 Ceramic Sealed Chip Testing

material

BeCuPeekAL

Other integrated circuits

100

Applicable scenarios

Analyze and test QFN chips, perform high and low temperature aging tests, and burn chips

Overall size (including pins)

14x16x1mm

Encapsulation method

QFP packaging

Number of pins

100 of them

Place of Origin

Shenzhen

Pin spacing

0.5mm

Test seat type

Flip knob type

quantity

encapsulation

CQFP

Batch number

Subject to shipment

Details

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