Original factory customized BGA898CPU power chip testing fixture BGA packaging chip analysis function testing stand

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Attributes

Original factory customized BGA898CPU power chip testing fixture BGA packaging chip analysis function testing stand

$714.14 ~ 1284.57

Reference Price

1individual (Min. Order)

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

Hongyi Electronics

Model number

BGA895-0.8 Flip Knob Test Fixture

packaging

boxed

Part status

on sale

Installation Type

Snap in type

Characteristics

Purpose of BGA898 functional testing

material

PEEKALBeCu

Other integrated circuits

898

Applicable scenarios

Analyze chips, test chips, perform high and low temperature aging tests, burn chips

encapsulation

BGA packaging

Number of pins

895 pieces

Place of Origin

Chinese Mainland

Test seat type

Flip knob type

Pin spacing

0.8mm

Main body dimensions

25x25x1mm

quantity

Batch number

Subject to shipment

Details

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